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Scientific and Technological Journals

Copper Engineering

Founded in 1984 and sponsored by Jiangxi Copper Corporation Limited, Copper Engineering is a comprehensive academic journal that fully reflects scientific discoveries and technological innovations across the entire industrial chain of non-ferrous metals, with a primary focus on copper.

Copper Engineering is classified as a T3-level journal (Important Academic Journal at Home and Abroad) in the High-Quality Scientific and Technological Journal Classification Directory of the Nonferrous Metals Field (2023). It is also a member of the Engineering and Technology Journal Cluster of the China Excellent Science and Technology Periodicals Action Plan (Phase II). The journal is indexed in Chemical Abstracts (CA, USA), Referativny Zhurnal (AJ, Russia), Index Copernicus International Journals Master List (ICI, Poland), China Core Journals (Selected) Database, Wanfang Database, VIP Chinese Scientific and Technological Journal Database, and the Advanced Platform for S&T Information and Communication, among others. According to the Annual Report for Chinese Academic Journal Impact Factors, the 2025 composite impact factor of Copper Engineering is 1.595, and the comprehensive impact factor is 1.487.

Aims and Scope:

Focusing on the nonferrous metals industry chain, the journal identifies and tracks major technological innovations, disseminates and promotes practical and applicable technologies, connects and serves scientific research and technical personnel, and advances the study of innovative theories, technologies, and processes in exploration, mining, beneficiation, metallurgy, processing, and copper-based new materials. It is committed to building a distinctive “copper-themed” brand among scientific and technological journals.

Scope of Coverage:

The journal publishes research results in metallurgical and chemical engineering, mining engineering, and materials science and technology within the nonferrous metals field, with a primary focus on copper. It highlights theoretical and applied innovations in copper-related industries, including mining, beneficiation, metallurgy, analytical testing, materials processing, low-carbon energy conservation, environmental engineering, digital and intelligent engineering, and comprehensive resource utilization.

Journal Homepage

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Contact

Website:  
http://www.tygc.net/ch/index.aspx
Tel:  
+86 0791-82710248 +86 0791-82710247
Email:  
tygc1984@vip.163.com

cMat

cMat is a new English-language journal sponsored by the State-owned Assets Supervision and Administration Commission of Jiangxi Province, jointly hosted by Jiangxi Copper Corporation Limited and the Nonferrous Metals Society of China, and published and operated by Youke Publishing Co., Ltd.

In November 2023, cMat was included as one of the 49 high-start new journals in the 2023 China Excellent Science and Technology Periodicals Action Plan.
In January 2024, cMat obtained its International Standard Serial Number (ISSN 3006-2691).
In January 2025, with the approval of the National Press and Publication Administration (Approval No. [2025] 53), cMat obtained its CN Serial Number (CN 36-1358/TB).

Aims and Scope:

Facing the global frontier of science and technology and major national needs, the journal focuses on the interdisciplinary integration of multiple fields including copper, gold, silver, lead, zinc, tungsten, rare earths, and rare and scattered metals. It publishes research results and applications related to copper-based new materials, builds a platform for academic exchange, promotes technological transformation, and advances the innovative development of China’s new materials sector.

Scope of Coverage:

The journal focuses on the innovative applications of emerging frontier technologies such as artificial intelligence, computer simulation, and process simulation in the fields of mining, beneficiation, and metallurgy. It also covers the latest research advances in advanced materials for aerospace (e.g., high-temperature alloys), energy (e.g., catalysts for energy conversion and storage), nanotechnology (e.g., nanomaterials), biomedicine (e.g., antibacterial agents), electronics (e.g., superconductors and semiconductor research), and supramolecular chemistry (e.g., copper-ion ligands). The journal publishes high-quality articles in the “10C” fields: copper, chemistry, composite, catalyst, cycle, conduction, cell, chip, carbon, and coating.

Journal Homepage

WeChat

Contact

Website:  
https://onlinelibrary.wiley.com/journal/30062691
Tel:  
+86 0791-82710248 +86 0791-82710247
Email:  
tygc1984@vip.163.com